Patent Assignment Details
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| Reel/Frame: | 045499/0775 | |
| Pages: | 3 |
| | Recorded: | 04/11/2018 | | |
| Attorney Dkt #: | LUMI-0189US |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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09/25/2018
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Application #:
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15438592
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Filing Dt:
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02/21/2017
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Publication #:
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Pub Dt:
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07/13/2017
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Title:
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LOW WARPAGE WAFER BONDING THROUGH USE OF SLOTTED SUBSTRATES
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Assignee
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| HIGH TECH CAMPUS 5 |
| EINDHOVEN, NETHERLANDS 5656 AE |
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Correspondence name and address
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CONVERGENCE INTELLECTUAL PROPERTY LAW P.C
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2251 GRANT RD. SUITE G
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LOS ALTOS, CA 94304
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