Patent Assignment Details
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Reel/Frame: | 045573/0967 | |
| Pages: | 5 |
| | Recorded: | 04/18/2018 | | |
Attorney Dkt #: | 170306 |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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15577457
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Filing Dt:
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04/12/2018
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Publication #:
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Pub Dt:
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08/09/2018
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Title:
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Au-BASED SOLDERING BALL, CERAMIC ELECTRONIC COMPONENT SEALED OR BONDED THEREWITH, AND METHOD FOR EVALUATING BONDING RELIABILITY OF SAID Au-BASED SOLDERING BALL
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Assignee
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11-3, SHIMBASHI 5-CHOME, MINATO-KU, |
TOKYO, JAPAN 105-8716 |
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Correspondence name and address
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KRATZ, QUINTOS & HANSON, LLP
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1420 K STREET, N.W.
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4TH FLOOR
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WASHINGTON, DC 20005
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