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Reel/Frame:045573/0967   Pages: 5
Recorded: 04/18/2018
Attorney Dkt #:170306
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 1
1
Patent #:
NONE
Issue Dt:
Application #:
15577457
Filing Dt:
04/12/2018
Publication #:
Pub Dt:
08/09/2018
Title:
Au-BASED SOLDERING BALL, CERAMIC ELECTRONIC COMPONENT SEALED OR BONDED THEREWITH, AND METHOD FOR EVALUATING BONDING RELIABILITY OF SAID Au-BASED SOLDERING BALL
Assignor
1
Exec Dt:
03/15/2018
Assignee
1
11-3, SHIMBASHI 5-CHOME, MINATO-KU,
TOKYO, JAPAN 105-8716
Correspondence name and address
KRATZ, QUINTOS & HANSON, LLP
1420 K STREET, N.W.
4TH FLOOR
WASHINGTON, DC 20005

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