Patent Assignment Details
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Reel/Frame: | 045619/0735 | |
| Pages: | 7 |
| | Recorded: | 04/24/2018 | | |
Attorney Dkt #: | TSU11102P00030US |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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07/16/2019
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Application #:
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15761841
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Filing Dt:
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03/21/2018
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Publication #:
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Pub Dt:
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09/27/2018
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Title:
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COMPOUND SEMICONDUCTOR SUBSTRATE WITH SiC LAYER
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Assignee
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2, KITA 3-JO NISHI 1-CHOME |
CHUO-KU, SAPPORO-SHI, HOKKAIDO, JAPAN 0600003 |
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Correspondence name and address
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WOOD, PHILLIPS, KATZ, CLARK & MORTIMER
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500 W. MADISON STREET
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SUITE 1130
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CHICAGO, IL 60661-2562
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