Patent Assignment Details
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Reel/Frame: | 045636/0489 | |
| Pages: | 6 |
| | Recorded: | 04/25/2018 | | |
Attorney Dkt #: | 11042.1001 US |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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10/29/2019
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Application #:
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15947181
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Filing Dt:
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04/06/2018
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Publication #:
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Pub Dt:
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10/11/2018
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Title:
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SEMICONDUCTOR PACKAGING METHOD AND SEMICONDUCTOR DEVICE BASED ON MOLDING PROCESS
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Assignee
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66-68 SHUNYU ROAD, YUYAO CITY |
NINGBO, ZHEJIANG, CHINA 315400 |
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Correspondence name and address
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HARVEST IP LAW, LLP
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1455 PENNSYLVANIA AVE NW SUITE 400
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WASHINGTON, DC 20004
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