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Patent Assignment Details
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Reel/Frame:045713/0521   Pages: 3
Recorded: 05/04/2018
Attorney Dkt #:52026.00.2001
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 1
1
Patent #:
Issue Dt:
11/16/2021
Application #:
15773586
Filing Dt:
05/04/2018
Publication #:
Pub Dt:
11/15/2018
Title:
ADHESION METHOD, ADHESION-STRUCTURE, AND ADHESION KIT
Assignors
1
Exec Dt:
04/03/2018
2
Exec Dt:
04/04/2018
3
Exec Dt:
04/03/2018
Assignee
1
1-2, SHIMO-HOZUMI, 1-CHOME
IBARAKI-SHI
OSAKA, JAPAN 567-8680
Correspondence name and address
VEDDER PRICE P.C.
1633 BROADWAY, 31ST FLOOR
NEW YORK, NY 10019

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