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Reel/Frame:045809/0281   Pages: 17
Recorded: 05/15/2018
Attorney Dkt #:26785US03
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 1
1
Patent #:
Issue Dt:
10/30/2018
Application #:
15211534
Filing Dt:
07/15/2016
Publication #:
Pub Dt:
11/03/2016
Title:
Semiconductor Package and Manufacturing Method Thereof
Assignors
1
Exec Dt:
07/25/2013
2
Exec Dt:
07/25/2013
3
Exec Dt:
07/25/2013
4
Exec Dt:
07/25/2013
5
Exec Dt:
07/26/2013
6
Exec Dt:
07/25/2013
7
Exec Dt:
09/03/2013
8
Exec Dt:
08/12/2013
9
Exec Dt:
07/30/2013
Assignee
1
2045 E. INNOVATION CIRCLE
TEMPE, ARIZONA 85284
Correspondence name and address
MCANDREWS, HELD & MALLOY, LTD.
500 WEST MADISON STREET
34TH FLOOR
CHICAGO, IL 60661

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