Patent Assignment Details
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| Reel/Frame: | 045855/0483 | |
| Pages: | 7 |
| | Recorded: | 05/21/2018 | | |
| Attorney Dkt #: | 180891 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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11/30/2021
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Application #:
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15764025
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Filing Dt:
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03/28/2018
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Publication #:
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Pub Dt:
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10/25/2018
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Title:
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WIRING STRUCTURE AND METHOD OF MANUFACTURING THE SAME, SEMICONDUCTOR DEVICE, MULTILAYER WIRING STRUCTURE AND METHOD OF MANUFACTURING THE SAME, SEMICONDUCTOR ELEMENT MOUNTING SUBSTRATE, METHOD OF FORMING PATTERN STRUCTURE, IMPRINT MOLD AND METHOD OF MANUFACTURING THE SAME, IMPRINT MOLD SET, AND METHOD OF MANUFACTURING MULTILAYER WIRING BOARD
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Assignee
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| 1-1, ICHIGAYA-KAGA-CHO 1-CHOME |
| SHINJUKU-KU |
| TOKYO-TO, JAPAN |
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Correspondence name and address
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JAMES A. OLIFF
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OLIFF PLC
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P.O. BOX 320850
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ALEXANDRIA, VA 22320-4850
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