Patent Assignment Details
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| Reel/Frame: | 045873/0437 | |
| Pages: | 4 |
| | Recorded: | 05/22/2018 | | |
| Attorney Dkt #: | P180361US00 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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15778006
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Filing Dt:
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05/22/2018
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Publication #:
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Pub Dt:
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12/06/2018
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Title:
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THERMOSETTING MATERIAL USED FOR REINFORCING FLEXIBLE PRINTED CIRCUIT BOARD, REINFORCED FLEXIBLE PRINTED CIRCUIT BOARD, METHOD FOR PRODUCING THE REINFORCED FLEXIBLE PRINTED CIRCUIT BOARD, AND ELECTRONIC DEVICE
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Assignee
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| 35-58, SAKASHITA 3-CHOME, ITABASHI-KU |
| TOKYO, JAPAN 174-8520 |
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Correspondence name and address
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WESTERMAN HATTORI DANIELS & ADRIAN LLP
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8500 LEESBURG PIKE, SUITE 7500
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TYSONS, VA 22182
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