Patent Assignment Details
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| Reel/Frame: | 045966/0866 | |
| Pages: | 4 |
| | Recorded: | 04/17/2018 | | |
| Attorney Dkt #: | 2515.0506 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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15955014
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Filing Dt:
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04/17/2018
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Publication #:
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Pub Dt:
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10/17/2019
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Title:
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Semiconductor Device and Method of Forming Conductive Vias to Have Enhanced Contact to Shielding Layer
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Assignee
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| 10 ANG MO KIO STREET 65 |
| TECHPOINT #04-08/09 |
| SINGAPORE, SINGAPORE 569059 |
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Correspondence name and address
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STATS CHIPPAC/PATENT LAW GROUP: ATKINS A
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55 N. ARIZONA PLACE, SUITE 104
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CHANDLER, AZ 85225
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