Patent Assignment Details
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| Reel/Frame: | 046022/0899 | |
| Pages: | 2 |
| | Recorded: | 04/26/2018 | | |
| Attorney Dkt #: | TSMP20170503US00 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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12/22/2020
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Application #:
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15940029
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Filing Dt:
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03/29/2018
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Publication #:
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Pub Dt:
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01/03/2019
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Title:
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SEMICONDUCTOR PACKAGE AND METHOD
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Assignee
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| 8, LI-HSIN RD. 6 |
| HSINCHU SCIENCE PARK |
| HSINCHU, TAIWAN 300-78 |
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Correspondence name and address
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SLATER MATSIL, LLP/TSMC
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17950 PRESTON ROAD, SUITE 1000
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DALLAS, TX 75252
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