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Reel/Frame:046128/0040   Pages: 4
Recorded: 06/19/2018
Attorney Dkt #:20374-139681
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 1
1
Patent #:
Issue Dt:
07/24/2018
Application #:
15276847
Filing Dt:
09/27/2016
Publication #:
Pub Dt:
01/19/2017
Title:
STRUCTURE CONTAINING CONDUCTOR CIRCUIT, METHOD FOR MANUFACTURING SAME, AND HEAT-CURABLE RESIN COMPOSITION
Assignors
1
Exec Dt:
04/18/2014
2
Exec Dt:
04/18/2014
3
Exec Dt:
04/18/2014
4
Exec Dt:
04/18/2014
Assignee
1
9-2, MARUNOUCHI 1-CHOME
CHIYODA-KU
TOKYO, JAPAN 100-6606
Correspondence name and address
ALAN E. SCHIAVELLI
1250 23RD STREET NW, SUITE 410
WASHINGTON, DC 20037-1164

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