Patent Assignment Details
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For pending or abandoned applications please consult USPTO staff.
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| Reel/Frame: | 046186/0122 | |
| Pages: | 3 |
| | Recorded: | 06/24/2018 | | |
| Attorney Dkt #: | 79412-US-1291 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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12/03/2019
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Application #:
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16011649
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Filing Dt:
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06/19/2018
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Publication #:
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Pub Dt:
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12/20/2018
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Title:
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APPARATUS FOR LASER BONDING OF FLIP CHIP AND METHOD FOR LASER BONDING OF FLIP CHIP
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Assignee
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| 11-14, SIMIN-DAERO 327BEON-GIL, DONGAN-GU, ANYANG-SI, |
| GYEONGGI-DO, KOREA, REPUBLIC OF 14055 |
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Correspondence name and address
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JCIPRNET
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P.O. BOX 600 TAIPEI GUTING
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TAIPEI CITY, 10099 TAIWAN
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