Patent Assignment Details
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| Reel/Frame: | 046301/0722 | |
| Pages: | 3 |
| | Recorded: | 07/10/2018 | | |
| Attorney Dkt #: | 15665-000020-US |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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06/09/2020
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Application #:
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16030925
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Filing Dt:
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07/10/2018
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Publication #:
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Pub Dt:
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01/16/2020
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Title:
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Semiconductor Device and Method for Forming the Semiconductor Device
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Assignee
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| 3-6-3 KITANO |
| NIIZA-SHI, SAITAMA, JAPAN 352-8666 |
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Correspondence name and address
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HARNESS, DICKEY & PIERCE, P.L.C.
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5445 CORPORATE DR.
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SUITE 200
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TROY, 48098 UNITED STATES
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05/07/2024 02:48 AM
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