Patent Assignment Details
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For pending or abandoned applications please consult USPTO staff.
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Reel/Frame: | 046434/0797 | |
| Pages: | 12 |
| | Recorded: | 07/23/2018 | | |
Attorney Dkt #: | 404797-US-NP / 170101-123 |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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16043098
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Filing Dt:
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07/23/2018
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Publication #:
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Pub Dt:
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01/23/2020
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Title:
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ELECTROFORM VAPOR CHAMBER INTEGRATED THERMAL MODULE INTO PCB LAYOUT DESIGN
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Assignee
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ONE MICROSOFT WAY |
REDMOND, WASHINGTON 98052 |
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Correspondence name and address
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NOVOTECHIP INTERNATIONAL PLLC
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1717 PENNSYLVANIA AVE. NW, SUITE #1025
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WASHINGTON, DC 20006
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