Patent Assignment Details
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| Reel/Frame: | 046533/0805 | |
| Pages: | 3 |
| | Recorded: | 08/02/2018 | | |
| Attorney Dkt #: | 18-836 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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09/17/2019
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Application #:
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16020702
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Filing Dt:
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06/27/2018
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Publication #:
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Pub Dt:
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01/03/2019
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Title:
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3D Packaging Method for Semiconductor Components
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Assignee
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| KAPELDREEF 75 |
| LEUVEN, BELGIUM 3001 |
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Correspondence name and address
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MCDONNELL BOEHNEN HULBERT & BERGHOFF LLP
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300 SOUTH WACKER DRIVE
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CHICAGO, IL 60606
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04/27/2024 06:58 PM
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