Patent Assignment Details
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
|
| Reel/Frame: | 046633/0360 | |
| Pages: | 5 |
| | Recorded: | 08/14/2018 | | |
| Attorney Dkt #: | P88788PCT |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
|
|
Total properties:
1
|
|
|
|
Patent #:
|
|
Issue Dt:
|
01/21/2020
|
Application #:
|
15769705
|
Filing Dt:
|
04/19/2018
|
|
Publication #:
|
|
Pub Dt:
|
10/25/2018
| | |
PCT #:
|
US2015063046
|
|
Title:
|
STACKED DIE PACKAGE WITH THROUGH-MOLD THERMALLY CONDUCTIVE STRUCTURES BETWEEN A BOTTOM DIE AND A THERMALLY CONDUCTIVE MATERIAL
|
|
|
Assignee
|
|
|
|
|
| 2200 MISSION COLLEGE BOULEVARD |
| SANTA CLARA, CALIFORNIA 95054 |
|
|
Correspondence name and address
|
| |
JUSTIN K. BRASK
|
| |
1211 SW 5TH AVENUE, STE. 1600
|
| |
PORTLAND, OR 97204
|
Search Results as of:
05/10/2024 04:58 PM
If you have any comments or questions concerning the data displayed,
contact
PRD / Assignments at 571-272-3350. v.2.6
Web interface last modified:
August 25, 2017 v.2.6
|
