Patent Assignment Details
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| Reel/Frame: | 046644/0218 | |
| Pages: | 5 |
| | Recorded: | 08/21/2018 | | |
| Attorney Dkt #: | FIS820160013US01 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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02/18/2020
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Application #:
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16106577
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Filing Dt:
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08/21/2018
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Publication #:
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Pub Dt:
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02/27/2020
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Title:
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Integrated Circuit Chip Carrier with In-Plane Thermal Conductance Layer
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Assignee
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| NEW ORCHARD ROAD |
| ARMONK, NEW YORK 10504 |
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Correspondence name and address
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ZIP GROUP PLLC - IBM FIS
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610 KINGSVIEW LN N
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MINNEAPOLIS, MN 55447
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