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Reel/Frame:046658/0091   Pages: 3
Recorded: 08/22/2018
Attorney Dkt #:TIPI 3.3-890 DIV CON
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 1
1
Patent #:
Issue Dt:
08/18/2020
Application #:
15988218
Filing Dt:
05/24/2018
Publication #:
Pub Dt:
09/20/2018
Title:
CHIP-SIZE, DOUBLE SIDE CONNECTION PACKAGE AND METHOD FOR MANUFACTURING THE SAME
Assignor
1
Exec Dt:
11/29/2013
Assignee
1
3025 ORCHARD PARKWAY
SAN JOSE, CALIFORNIA 95134
Correspondence name and address
LERNER, DAVID, LITTENBERG, KRUMHOLZ & MENTLIK, LLP
600 SOUTH AVENUE WEST
WESTFIELD, NJ 07090

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