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Reel/Frame:046773/0447   Pages: 4
Recorded: 08/10/2018
Attorney Dkt #:890102.407
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 1
1
Patent #:
Issue Dt:
01/21/2020
Application #:
16005363
Filing Dt:
06/11/2018
Publication #:
Pub Dt:
12/12/2019
Title:
FORMING SEMICONDUCTOR STRUCTURES WITH TWO-DIMENSIONAL MATERIALS
Assignors
1
Exec Dt:
04/10/2018
2
Exec Dt:
04/10/2018
3
Exec Dt:
04/10/2018
Assignees
1
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK
HSINCHU, TAIWAN 300-78
2
NO. 1, SEC. 4, ROOSEVELT ROAD, ZHONGZHENG DISTRICT
TAIPEI CITY, TAIWAN 100
Correspondence name and address
SEED IP LAW GROUP LLP
701 FIFTH AVENUE SUITE 5400
SEATTLE, WA 98104

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