Patent Assignment Details
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| Reel/Frame: | 046782/0766 | |
| Pages: | 4 |
| | Recorded: | 09/04/2018 | | |
| Attorney Dkt #: | TSMP20180427US01 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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04/14/2020
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Application #:
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16121360
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Filing Dt:
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09/04/2018
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Publication #:
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Pub Dt:
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08/15/2019
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Title:
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Via for Semiconductor Device Connection and Methods of Forming the Same
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Assignee
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| 8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK |
| HSINCHU, TAIWAN 300-78 |
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Correspondence name and address
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SLATER MATSIL, LLP
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17950 PRESTON RD., SUITE 1000
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DALLAS, TX 75252
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05/21/2024 02:55 PM
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