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Reel/Frame:046832/0111   Pages: 2
Recorded: 09/10/2018
Attorney Dkt #:T5057-847C
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 1
1
Patent #:
Issue Dt:
10/13/2020
Application #:
16126906
Filing Dt:
09/10/2018
Publication #:
Pub Dt:
01/24/2019
Title:
SEMICONDUCTOR STRUCTURE HAVING SETS OF III-V COMPOUND LAYERS AND METHOD OF FORMING
Assignors
1
Exec Dt:
01/11/2013
2
Exec Dt:
01/11/2013
3
Exec Dt:
01/11/2018
4
Exec Dt:
01/11/2013
Assignee
1
NO. 8, LI-HSIN RD. VI, HSINCHU SCIENCE PARK
HSINCHU, TAIWAN 300
Correspondence name and address
HAUPTMAN HAM, LLP (TSMC)
2318 MILL ROAD
SUITE 1400
ALEXANDRIA, VA 22314

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