Patent Assignment Details
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| Reel/Frame: | 046933/0001 | |
| Pages: | 5 |
| | Recorded: | 09/20/2018 | | |
| Attorney Dkt #: | TMR-P0006 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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11/17/2020
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Application #:
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16137476
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Filing Dt:
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09/20/2018
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Publication #:
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Pub Dt:
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03/21/2019
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Title:
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FLUX, SOLDER PASTE, AND METHOD FOR FORMING SOLDER BUMP
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Assignee
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| 1-19-43, HIGASHI-OIZUMI, NERIMA-KU |
| TOKYO, JAPAN 178-8511 |
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Correspondence name and address
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MORI & WARD, LLP
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225 REINEKERS LANE
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SUITE 690
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ALEXANDRIA, VA 22314
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