Patent Assignment Details
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For pending or abandoned applications please consult USPTO staff.
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| Reel/Frame: | 046941/0086 | |
| Pages: | 7 |
| | Recorded: | 09/21/2018 | | |
| Attorney Dkt #: | 114898-8005.US06 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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01/12/2021
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Application #:
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16138370
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Filing Dt:
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09/21/2018
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Publication #:
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Pub Dt:
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01/31/2019
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Title:
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WAFER-LEVEL LIGHT EMITTING DIODE PACKAGE AND METHOD OF FABRICATING THE SAME
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Assignee
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| 1B-25, 97-11, SANDAN-RO 163BEON-GIL |
| DANWON-GU, ANSAN-SI |
| GYEONGGI-DO, KOREA, REPUBLIC OF |
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Correspondence name and address
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BING AI
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PO BOX 1247
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SEATTLE, WA 98111-1247
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