Patent Assignment Details
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| Reel/Frame: | 047008/0868 | |
| Pages: | 3 |
| | Recorded: | 09/28/2018 | | |
| Attorney Dkt #: | 1034232-000329 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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10/25/2022
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Application #:
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16089834
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Filing Dt:
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09/28/2018
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Publication #:
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Pub Dt:
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03/21/2019
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Title:
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METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE BY BACKGRINDING SEMICONDUCTOR WAFER USING AN ADHESIVE FILM
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Assignee
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| 7, KANDAMITOSHIRO-CHO |
| CHIYODA-KU, TOKYO, JAPAN 101-8485 |
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Correspondence name and address
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BUCHANAN INGERSOLL & ROONEY
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PO BOX 1404
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ALEXANDRIA, VA 22314-2727
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04/29/2024 09:29 PM
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