Patent Assignment Details
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| Reel/Frame: | 047163/0267 | |
| Pages: | 2 |
| | Recorded: | 10/15/2018 | | |
| Attorney Dkt #: | PT033053USCNT |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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11/27/2018
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Application #:
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15631223
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Filing Dt:
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06/23/2017
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Publication #:
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Pub Dt:
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10/12/2017
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Title:
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SINTERABLE BONDING MATERIAL AND SEMICONDUCTOR DEVICE USING THE SAME
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Assignee
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| 2-2-8 HIGASHI SHINAGAWA, SHINAGAWA-KU |
| TOKYO, JAPAN |
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Correspondence name and address
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HENKEL CORPORATION
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ONE HENKEL WAY
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ROCKY HILL, CT 06067
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