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Reel/Frame:047163/0570   Pages: 3
Recorded: 10/15/2018
Attorney Dkt #:PT033053USCNT
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 1
1
Patent #:
Issue Dt:
11/27/2018
Application #:
15631223
Filing Dt:
06/23/2017
Publication #:
Pub Dt:
10/12/2017
Title:
SINTERABLE BONDING MATERIAL AND SEMICONDUCTOR DEVICE USING THE SAME
Assignor
1
Exec Dt:
06/19/2017
Assignee
1
HENKELSTRASSE 67
DUESSELDORF, GERMANY 40589
Correspondence name and address
HENKEL CORPORATION
ONE HENKEL WAY
ROCKY HILL, CT 06067

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