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Patent Assignment Details
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Reel/Frame:047172/0505   Pages: 3
Recorded: 10/01/2018
Attorney Dkt #:102351-1221;1222;1223
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 3
1
Patent #:
Issue Dt:
01/08/2013
Application #:
12877457
Filing Dt:
09/08/2010
Publication #:
Pub Dt:
03/10/2011
Title:
MANUFACTURING METHOD OF LEADFRAME AND SEMICONDUCTOR DEVICE
2
Patent #:
Issue Dt:
09/04/2012
Application #:
12911212
Filing Dt:
10/25/2010
Publication #:
Pub Dt:
04/28/2011
Title:
LEAD FRAME AND INTERMEDIATE PRODUCT OF SEMICONDUCTOR DEVICE
3
Patent #:
Issue Dt:
03/25/2014
Application #:
13129649
Filing Dt:
05/17/2011
Publication #:
Pub Dt:
11/10/2011
Title:
LEAD FRAME, SEMICONDUCTOR APPARATUS USING THIS LEAD FRAME, INTERMEDIATE PRODUCT THEREOF AND MANUFACTURING METHOD THEREOF
Assignor
1
Exec Dt:
09/27/2018
Assignee
1
26 CHIN 3RD ROAD, NANTZE EXPORT PROCESSING ZONE
KAOHSIUNG, TAIWAN
Correspondence name and address
FOLEY & LARDNER LLP
3000 K STREET, N.W.
SUITE 600
WASHINGTON, DC 20007

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