Patent Assignment Details
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| Reel/Frame: | 047235/0178 | |
| Pages: | 3 |
| | Recorded: | 10/19/2018 | | |
| Attorney Dkt #: | TOR-389US |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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11/30/2021
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Application #:
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16074187
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Filing Dt:
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07/31/2018
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Publication #:
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Pub Dt:
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05/13/2021
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Title:
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RESIN COMPOSITION, RESIN LAYER, PERMANENT ADHESIVE, ADHESIVE FOR TEMPORARY BONDING, LAMINATED FILM, PROCESSED WAFER, AND METHOD FOR MANUFACTURING ELECTRONIC COMPONENT OR SEMICONDUCTOR DEVICE
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Assignee
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| 1-1, NIHONBASHI-MUROMACHI 2-CHOME |
| CHUO-KU |
| TOKYO, JAPAN 1038666 |
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Correspondence name and address
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BRIAN L. MUTSCHLER
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RATNERPRESTIA
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2200 RENAISSANCE BLVD., SUITE 350
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KING OF PRUSSIA, PA 19406
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