Patent Assignment Details
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For pending or abandoned applications please consult USPTO staff.
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| Reel/Frame: | 047321/0948 | |
| Pages: | 4 |
| | Recorded: | 10/25/2018 | | |
| Attorney Dkt #: | 81757-US-PA |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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07/21/2020
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Application #:
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16171335
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Filing Dt:
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10/25/2018
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Publication #:
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Pub Dt:
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04/30/2020
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Title:
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SEMICONDCUTOR PACKAGE AND MANUFACTURING METHOD OF SEMICONDCUTOR PACKAGE
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Assignee
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| NO.8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, |
| HSINCHU, TAIWAN 30078 |
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Correspondence name and address
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JCIPRNET
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P.O. BOX 600 TAIPEI GUTING
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TAIPEI CITY, 10099 TAIWAN
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