Patent Assignment Details
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Reel/Frame: | 047375/0539 | |
| Pages: | 12 |
| | Recorded: | 09/05/2018 | | |
Attorney Dkt #: | 11274.0025-00000 |
Conveyance: | CORRECTIVE ASSIGNMENT TO CORRECT THE OMITTED ASSIGNORS PREVIOUSLY RECORDED AT REEL: 046342 FRAME: 0175. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT. |
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Total properties:
1
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Patent #:
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Issue Dt:
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10/17/2023
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Application #:
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16019923
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Filing Dt:
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06/27/2018
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Publication #:
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Pub Dt:
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10/25/2018
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Title:
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SUBSTRATE BONDING APPARATUS AND SUBSTRATE BONDING METHOD
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Assignee
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15-3, KONAN 2-CHOME, MINATO-KU |
TOKYO, JAPAN 1086290 |
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Correspondence name and address
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FINNEGAN, HENDERSON, FARABOW, GARRETT &
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901 NEW YORK AVENUE, NW
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WASHINGTON, DC 20001-4413
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05/02/2024 01:46 AM
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