Patent Assignment Details
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| Reel/Frame: | 047399/0576 | |
| Pages: | 3 |
| | Recorded: | 11/02/2018 | | |
| Attorney Dkt #: | 114124-0230 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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16109665
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Filing Dt:
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08/22/2018
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Publication #:
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Pub Dt:
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09/19/2019
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Title:
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POLISHING PAD, SEMICONDUCTOR FABRICATING DEVICE AND FABRICATING METHOD OF SEMICONDUCTOR DEVICE
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Assignee
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| 1-1 SHIBAURA 1-CHOME |
| MINATO-KU, TOKYO, JAPAN 105-0023 |
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Correspondence name and address
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FOLEY & LARDNER LLP
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3000 K ST NW
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WASHINGTON, DC 20007
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