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Reel/Frame:047420/0826   Pages: 5
Recorded: 11/06/2018
Attorney Dkt #:2515.0515
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 1
1
Patent #:
Issue Dt:
02/08/2022
Application #:
16181619
Filing Dt:
11/06/2018
Publication #:
Pub Dt:
05/07/2020
Title:
Method and Device for Reducing Metal Burrs When Sawing Semiconductor Packages
Assignors
1
Exec Dt:
11/06/2018
2
Exec Dt:
11/06/2018
3
Exec Dt:
11/06/2018
Assignee
1
10 ANG MO KIO STREET 65
TECHPOINT #04-08/09
SINGAPORE, SINGAPORE 569059
Correspondence name and address
PATENT LAW GROUP: ATKINS AND ASSOCIATES
55 N. ARIZONA PLACE
SUITE 104
CHANDLER, AZ 85225

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