Patent Assignment Details
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| Reel/Frame: | 047568/0317 | |
| Pages: | 3 |
| | Recorded: | 11/23/2018 | | |
| Attorney Dkt #: | 7466-1807763 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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16198960
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Filing Dt:
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11/23/2018
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Publication #:
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Pub Dt:
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04/25/2019
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Title:
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Lead-Free Solder Alloy for Terminal Preliminary Plating, and Electronic Component
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Assignee
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| 23, SENJU-HASHIDO-CHO |
| ADACHI-KU |
| TOKYO, JAPAN 120-8555 |
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Correspondence name and address
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THE WEBB LAW FIRM
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420 FT. DUQUESNE BLVD.
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ONE GATEWAY CENTER, SUITE 1200
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PITTSBURGH, PA 15222
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