Patent Assignment Details
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
|
| Reel/Frame: | 047649/0629 | |
| Pages: | 15 |
| | Recorded: | 12/03/2018 | | |
| Attorney Dkt #: | PI100593 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
|
|
Total properties:
1
|
|
|
|
Patent #:
|
|
Issue Dt:
|
06/23/2020
|
Application #:
|
16203752
|
Filing Dt:
|
11/29/2018
|
|
Publication #:
|
|
Pub Dt:
|
06/27/2019
| | | | |
|
Title:
|
CMOS Image Sensor Encapsulation Structure and Method for Manufacturing the Same
|
|
|
Assignee
|
|
|
|
|
| NO. 88, BAICAO STREET |
| WEST HIGH-TECH DEVELOPMENT ZONE |
| CHENGDU, SICHUAN, CHINA 611730 |
|
|
Correspondence name and address
|
| |
BERGGREN LLP
|
| |
ONE GATEWAY CENTER, SUITE 2600
|
| |
NEWARK, NJ 07102
|
Search Results as of:
05/14/2024 01:25 AM
If you have any comments or questions concerning the data displayed,
contact
PRD / Assignments at 571-272-3350. v.2.6
Web interface last modified:
August 25, 2017 v.2.6
|
