Patent Assignment Details
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| Reel/Frame: | 047689/0948 | |
| Pages: | 6 |
| | Recorded: | 10/17/2018 | | |
| Attorney Dkt #: | AUS920070270US1 |
| Conveyance: | CORRECTIVE ASSIGNMENT TO CORRECT THE ASSIGNEE'S NAME PREVIOUSLY RECORDED AT REEL: 019327 FRAME: 0325. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT. |
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Total properties:
1
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Patent #:
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Issue Dt:
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01/12/2010
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Application #:
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11751786
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Filing Dt:
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05/22/2007
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Publication #:
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Pub Dt:
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11/27/2008
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Title:
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MULTI-LAYER CIRCUIT SUBSTRATE AND METHOD HAVING IMPROVED TRANSMISSION LINE INTEGRITY AND INCREASED ROUTING DENSITY
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Assignee
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| NEW ORCHARD ROAD |
| ARMONK, NEW YORK 10504 |
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Correspondence name and address
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IBM CORPORATION
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11501 BURNET ROAD
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INTELLECTUAL PROPERTY LAW
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AUSTIN, NY 78758
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