Patent Assignment Details
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| Reel/Frame: | 047868/0481 | |
| Pages: | 3 |
| | Recorded: | 12/28/2018 | | |
| Attorney Dkt #: | P20171498US00/N1085-01743 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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16045546
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Filing Dt:
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07/25/2018
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Publication #:
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Pub Dt:
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04/11/2019
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Title:
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INTERCONNECTION STRUCTURE LINED BY ISOLATION LAYER
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Assignee
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| NO. 8, LI-HSIN ROAD 6, HSINCHU SCIENCE PARK |
| HSIN-CHU, TAIWAN 300-77 |
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Correspondence name and address
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DUANE MORRIS LLP (TSMC) IP DEPARTMENT
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30 SOUTH 17TH STREET
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PHILADELPHIA, PA 19103-4196
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