Patent Assignment Details
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| Reel/Frame: | 048050/0806 | |
| Pages: | 4 |
| | Recorded: | 01/17/2019 | | |
| Attorney Dkt #: | PT031907 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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03/26/2019
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Application #:
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15945772
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Filing Dt:
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04/05/2018
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Publication #:
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Pub Dt:
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08/09/2018
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Title:
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FORMULATIONS CONTAINING MIXED RESIN SYSTEMS AND THE USE THEREOF FOR WAFER-LEVEL UNDERFILL FOR 3D TSV PACKAGES
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Assignee
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| HENKELSTRASSE 67 |
| DUESSELDORF, GERMANY 40589 |
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Correspondence name and address
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HENKEL CORPORATION
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ONE HENKEL WAY
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ROCKY HILL, CT 06067
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04/23/2024 11:47 PM
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