|
Total properties:
69
|
|
|
|
Patent #:
|
|
Issue Dt:
|
11/02/2004
|
Application #:
|
09764913
|
Filing Dt:
|
01/17/2001
|
|
Title:
|
METHOD AND APPARATUS FOR ASSEMBLING AN ARRAY OF MICRO-DEVICES
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
06/06/2006
|
Application #:
|
10866123
|
Filing Dt:
|
06/12/2004
|
|
Publication #:
|
|
Pub Dt:
|
01/06/2005
| | | | |
|
Title:
|
METHOD AND APPARATUS FOR ASSEMBLING AN ARRAY OF MICRO-DEVICES
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
05/01/2007
|
Application #:
|
11151442
|
Filing Dt:
|
06/14/2005
|
|
Publication #:
|
|
Pub Dt:
|
12/14/2006
| | | | |
|
Title:
|
MEMS TEETER-TOTTER APPARATUS WITH CURVED BEAM AND METHOD OF MANUFACTURE
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
05/05/2009
|
Application #:
|
11211623
|
Filing Dt:
|
08/26/2005
|
|
Publication #:
|
|
Pub Dt:
|
10/11/2007
| | | | |
|
Title:
|
DUAL SUBSTRATE ELECTROSTATIC MEMS SWITCH WITH HERMETIC SEAL AND METHOD OF MANUFACTURE
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
06/19/2007
|
Application #:
|
11211624
|
Filing Dt:
|
08/26/2005
|
|
Publication #:
|
|
Pub Dt:
|
03/01/2007
| | | | |
|
Title:
|
TRENCH PLATING PROCESS AND APPARATUS FOR THROUGH HOLE VIAS
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
09/01/2009
|
Application #:
|
11211625
|
Filing Dt:
|
08/26/2005
|
|
Publication #:
|
|
Pub Dt:
|
03/01/2007
| | | | |
|
Title:
|
HERMETIC INTERCONNECT STRUCTURE AND METHOD OF MANUFACTURE
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
10/02/2007
|
Application #:
|
11221745
|
Filing Dt:
|
09/09/2005
|
|
Publication #:
|
|
Pub Dt:
|
03/15/2007
| | | | |
|
Title:
|
MULTIPLE SWITCH MEMS STRUCTURE AND METHOD OF MANUFACTURE
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
11/28/2006
|
Application #:
|
11272689
|
Filing Dt:
|
11/15/2005
|
|
Publication #:
|
|
Pub Dt:
|
03/23/2006
| | | | |
|
Title:
|
METHOD AND APPARATUS FOR ASSEMBLING AN ARRAY OF MICRO-DEVICES
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
08/04/2009
|
Application #:
|
11304601
|
Filing Dt:
|
12/16/2005
|
|
Publication #:
|
|
Pub Dt:
|
03/01/2007
| | | | |
|
Title:
|
WAFER LEVEL HERMETIC BOND USING METAL ALLOY WITH RAISED FEATURE
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
06/16/2009
|
Application #:
|
11334438
|
Filing Dt:
|
01/19/2006
|
|
Publication #:
|
|
Pub Dt:
|
07/26/2007
| | | | |
|
Title:
|
HYSTERETIC MEMS THERMAL DEVICE AND METHOD OF MANUFACTURE
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
05/19/2009
|
Application #:
|
11347219
|
Filing Dt:
|
02/06/2006
|
|
Publication #:
|
|
Pub Dt:
|
08/09/2007
| | | | |
|
Title:
|
ELASTIC INTERFACE FOR WAFER BONDING APPARATUS
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
08/31/2010
|
Application #:
|
11359558
|
Filing Dt:
|
02/23/2006
|
|
Publication #:
|
|
Pub Dt:
|
08/23/2007
| | | | |
|
Title:
|
SYSTEM AND METHOD FOR FORMING MOVEABLE FEATURES ON A COMPOSITE SUBSTRATE
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
01/18/2011
|
Application #:
|
11378340
|
Filing Dt:
|
03/20/2006
|
|
Publication #:
|
|
Pub Dt:
|
09/20/2007
| | | | |
|
Title:
|
MEMS THERMAL DEVICE WITH SLIDEABLY ENGAGED TETHER AND METHOD OF MANUFACTURE
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
10/12/2010
|
Application #:
|
11386733
|
Filing Dt:
|
03/23/2006
|
|
Publication #:
|
|
Pub Dt:
|
09/27/2007
| | | | |
|
Title:
|
MEMS DEVICE USING NIMN ALLOY AND METHOD OF MANUFACTURE
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
10/05/2010
|
Application #:
|
11390085
|
Filing Dt:
|
03/28/2006
|
|
Publication #:
|
|
Pub Dt:
|
10/11/2007
| | | | |
|
Title:
|
WAFER BONDING MATERIAL WITH EMBEDDED RIGID PARTICLES
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
12/09/2008
|
Application #:
|
11433435
|
Filing Dt:
|
05/15/2006
|
|
Publication #:
|
|
Pub Dt:
|
11/15/2007
| | | | |
|
Title:
|
INDENTED STRUCTURE FOR ENCAPSULATED DEVICES AND METHOD OF MANUFACTURE
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
06/23/2009
|
Application #:
|
11434768
|
Filing Dt:
|
05/17/2006
|
|
Publication #:
|
|
Pub Dt:
|
11/22/2007
| | | | |
|
Title:
|
SYSTEM AND METHOD FOR PROVIDING ACCESS TO AN ENCAPSULATED DEVICE
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
05/25/2010
|
Application #:
|
11516489
|
Filing Dt:
|
09/07/2006
|
|
Publication #:
|
|
Pub Dt:
|
03/13/2008
| | | | |
|
Title:
|
SINGLY ATTACHED MEMS THERMAL DEVICE AND METHOD OF MANUFACTURE
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
03/09/2010
|
Application #:
|
11541774
|
Filing Dt:
|
10/03/2006
|
|
Publication #:
|
|
Pub Dt:
|
04/03/2008
| | | | |
|
Title:
|
INTERCONNECT STRUCTURE USING THROUGH WAFER VIAS AND METHOD OF FABRICATION
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
03/30/2010
|
Application #:
|
11546288
|
Filing Dt:
|
10/12/2006
|
|
Publication #:
|
|
Pub Dt:
|
04/17/2008
| | | | |
|
Title:
|
CONTACT ELECTRODE FOR MICRODEVICES AND ETCH METHOD OF MANUFACTURE
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
03/30/2010
|
Application #:
|
11605312
|
Filing Dt:
|
11/29/2006
|
|
Publication #:
|
|
Pub Dt:
|
05/29/2008
| | | | |
|
Title:
|
CURRENT-DRIVEN DEVICE USING NIMN ALLOY AND METHOD OF MANUFACTURE
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
12/01/2009
|
Application #:
|
11705738
|
Filing Dt:
|
02/14/2007
|
|
Publication #:
|
|
Pub Dt:
|
07/19/2007
| | | | |
|
Title:
|
HYSTERETIC MEMS TWO-DIMENSIONAL THERMAL DEVICE AND METHOD OF MANUFACTURE
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
11/24/2009
|
Application #:
|
11705739
|
Filing Dt:
|
02/14/2007
|
|
Publication #:
|
|
Pub Dt:
|
08/14/2008
| | | | |
|
Title:
|
MEMS THERMAL ACTUATOR AND METHOD OF MANUFACTURE
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
06/28/2011
|
Application #:
|
11797659
|
Filing Dt:
|
05/07/2007
|
|
Publication #:
|
|
Pub Dt:
|
11/13/2008
| | | | |
|
Title:
|
LID STRUCTURE FOR MICRODEVICE AND METHOD OF MANUFACTURE
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
02/22/2011
|
Application #:
|
11797924
|
Filing Dt:
|
05/09/2007
|
|
Publication #:
|
|
Pub Dt:
|
11/13/2008
| | | | |
|
Title:
|
DUAL SUBSTRATE MEMS PLATE SWITCH AND METHOD OF MANUFACTURE
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
05/11/2010
|
Application #:
|
11826841
|
Filing Dt:
|
07/19/2007
|
|
Publication #:
|
|
Pub Dt:
|
01/22/2009
| | | | |
|
Title:
|
ETCHING/BONDING CHAMBER FOR ENCAPSULATED DEVICES AND METHOD OF USE
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
07/05/2011
|
Application #:
|
11896648
|
Filing Dt:
|
09/05/2007
|
|
Publication #:
|
|
Pub Dt:
|
12/27/2007
| | | | |
|
Title:
|
WAFER BONDING MATERIAL WITH EMBEDDED CONDUCTIVE PARTICLES
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
01/04/2011
|
Application #:
|
12068586
|
Filing Dt:
|
02/08/2008
|
|
Publication #:
|
|
Pub Dt:
|
11/13/2008
| | | | |
|
Title:
|
MEMS PLATE SWITCH AND METHOD OF MANUFACTURE
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
01/03/2012
|
Application #:
|
12232298
|
Filing Dt:
|
09/15/2008
|
|
Publication #:
|
|
Pub Dt:
|
01/19/2012
| | | | |
|
Title:
|
SYSTEM AND METHOD FOR PROVIDING ACCESS TO AN ENCAPSULATED DEVICE
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
07/20/2010
|
Application #:
|
12285817
|
Filing Dt:
|
10/15/2008
|
|
Publication #:
|
|
Pub Dt:
|
02/26/2009
| | | | |
|
Title:
|
INDENTED LID FOR ENCAPSULATED DEVICES AND METHOD OF MANUFACTURE
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
05/17/2011
|
Application #:
|
12318634
|
Filing Dt:
|
01/05/2009
|
|
Publication #:
|
|
Pub Dt:
|
08/13/2009
| | | | |
|
Title:
|
HYSTERETIC MEMS THERMAL DEVICE AND METHOD OF MANUFACTURE
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
07/20/2010
|
Application #:
|
12382142
|
Filing Dt:
|
03/10/2009
|
|
Publication #:
|
|
Pub Dt:
|
07/16/2009
| | | | |
|
Title:
|
MEMS THERMAL ACTUATOR AND METHOD OF MANUFACTURE
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
06/14/2011
|
Application #:
|
12459956
|
Filing Dt:
|
07/11/2009
|
|
Publication #:
|
|
Pub Dt:
|
01/07/2010
| | | | |
|
Title:
|
WAFER LEVEL HERMETIC BOND USING METAL ALLOY WITH RAISED FEATURE
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
08/21/2012
|
Application #:
|
12588060
|
Filing Dt:
|
10/02/2009
|
|
Publication #:
|
|
Pub Dt:
|
01/28/2010
| | | | |
|
Title:
|
METHOD OF MANUFACTURING A HYSTERETIC MEMS TWO-DIMENSIONAL THERMAL DEVICE
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
09/24/2013
|
Application #:
|
12662237
|
Filing Dt:
|
04/07/2010
|
|
Publication #:
|
|
Pub Dt:
|
10/13/2011
| | | | |
|
Title:
|
Inlaid optical material and method of manufacture
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
04/08/2014
|
Application #:
|
12801162
|
Filing Dt:
|
05/26/2010
|
|
Publication #:
|
|
Pub Dt:
|
12/01/2011
| | | | |
|
Title:
|
IN-PLANE ELECTROMAGNETIC MEMS PUMP
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
01/01/2013
|
Application #:
|
12923693
|
Filing Dt:
|
10/05/2010
|
|
Publication #:
|
|
Pub Dt:
|
04/05/2012
| | | | |
|
Title:
|
PLATING PROCESS AND APPARATUS FOR THROUGH WAFER FEATURES
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
10/16/2012
|
Application #:
|
12923872
|
Filing Dt:
|
10/13/2010
|
|
Publication #:
|
|
Pub Dt:
|
02/03/2011
| | | | |
|
Title:
|
WAFER LEVEL HERMETIC BOND USING METAL ALLOY WITH KEEPER LAYER
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
06/18/2013
|
Application #:
|
12929257
|
Filing Dt:
|
01/11/2011
|
|
Publication #:
|
|
Pub Dt:
|
06/02/2011
| | | | |
|
Title:
|
CONFIGURABLE POWER SUPPLY USING MEMS SWITCH
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
09/11/2012
|
Application #:
|
12929259
|
Filing Dt:
|
01/11/2011
|
|
Publication #:
|
|
Pub Dt:
|
06/30/2011
| | | | |
|
Title:
|
DUAL SUBSTRATE MEMS PLATE SWITCH AND METHOD OF MANUFACTURE
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
12/17/2013
|
Application #:
|
13067325
|
Filing Dt:
|
05/25/2011
|
|
Publication #:
|
|
Pub Dt:
|
11/29/2012
| | | | |
|
Title:
|
Microfabricated electromagnetic actuator with push-pull motion
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
10/15/2013
|
Application #:
|
13137883
|
Filing Dt:
|
09/20/2011
|
|
Publication #:
|
|
Pub Dt:
|
03/22/2012
| | | | |
|
Title:
|
INDUCTIVE GETTER ACTIVATION FOR HIGH VACUUM PACKAGING
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
12/25/2012
|
Application #:
|
13373969
|
Filing Dt:
|
12/07/2011
|
|
Title:
|
METHOD AND APPARATUS FOR APPLYING THIN LIQUID COATINGS
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
10/28/2014
|
Application #:
|
13374898
|
Filing Dt:
|
01/23/2012
|
|
Publication #:
|
|
Pub Dt:
|
07/26/2012
| | | | |
|
Title:
|
MEMS PARTICLE SORTING ACTUATOR AND METHOD OF MANUFACTURING
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
09/02/2014
|
Application #:
|
13374899
|
Filing Dt:
|
01/23/2012
|
|
Publication #:
|
|
Pub Dt:
|
07/26/2012
| | | | |
|
Title:
|
Cartridge for MEMS particle sorting system
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
03/31/2015
|
Application #:
|
13506892
|
Filing Dt:
|
05/23/2012
|
|
Publication #:
|
|
Pub Dt:
|
10/11/2012
| | | | |
|
Title:
|
Multistage cartridge for MEMS particle storing system
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
05/27/2014
|
Application #:
|
13573201
|
Filing Dt:
|
08/30/2012
|
|
Publication #:
|
|
Pub Dt:
|
12/20/2012
| | | | |
|
Title:
|
WAFER LEVEL HERMETIC BOND USING METAL ALLOY WITH KEEPER LAYER
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
09/30/2014
|
Application #:
|
13986467
|
Filing Dt:
|
05/07/2013
|
|
Title:
|
EXOTHERMIC ACTIVATION FOR HIGH VACUUM PACKAGING
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
03/01/2016
|
Application #:
|
13987463
|
Filing Dt:
|
07/29/2013
|
|
Publication #:
|
|
Pub Dt:
|
01/29/2015
| | | | |
|
Title:
|
Microfabricated magnetic field transducer with flux guide
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
06/21/2016
|
Application #:
|
13987464
|
Filing Dt:
|
07/29/2013
|
|
Publication #:
|
|
Pub Dt:
|
01/29/2015
| | | | |
|
Title:
|
MEMS PARTICLE SORTING ACTUATOR AND METHOD OF MANUFACTURE
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
04/19/2016
|
Application #:
|
14142712
|
Filing Dt:
|
12/27/2013
|
|
Publication #:
|
|
Pub Dt:
|
07/02/2015
| | | | |
|
Title:
|
METHOD USING GLASS SUBSTRATE ANODIC BONDING
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
07/12/2016
|
Application #:
|
14158829
|
Filing Dt:
|
01/19/2014
|
|
Publication #:
|
|
Pub Dt:
|
07/02/2015
| | | | |
|
Title:
|
DEVICE USING GLASS SUBSTRATE ANODIC BONDING
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
10/20/2015
|
Application #:
|
14194794
|
Filing Dt:
|
03/02/2014
|
|
Publication #:
|
|
Pub Dt:
|
09/24/2015
| | | | |
|
Title:
|
WAFER LEVEL HERMETIC BOND USING METAL ALLOY WITH RAISED FEATURE AND WETTING LAYER
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
10/13/2015
|
Application #:
|
14326406
|
Filing Dt:
|
07/08/2014
|
|
Title:
|
METHOD AND DEVICE USING SILICON SUBSTRATE TO GLASS SUBSTRATE ANODIC BONDING
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
05/03/2016
|
Application #:
|
14456972
|
Filing Dt:
|
08/11/2014
|
|
Publication #:
|
|
Pub Dt:
|
02/11/2016
| | | | |
|
Title:
|
SOLDER BUMP SEALING METHOD AND DEVICE
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
04/26/2016
|
Application #:
|
14619068
|
Filing Dt:
|
02/11/2015
|
|
Publication #:
|
|
Pub Dt:
|
03/31/2016
| | | | |
|
Title:
|
METHOD FOR FORMING THROUGH SUBSTRATE VIAS WITH TETHERS
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
04/05/2016
|
Application #:
|
14738980
|
Filing Dt:
|
06/15/2015
|
|
Title:
|
METHOD FOR FORMING A MICROFABRICATED STRUCTURE
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
03/28/2017
|
Application #:
|
14931883
|
Filing Dt:
|
11/04/2015
|
|
Publication #:
|
|
Pub Dt:
|
05/05/2016
| | | | |
|
Title:
|
MICROFABRICATED OPTICAL APPARATUS
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
04/24/2018
|
Application #:
|
15060630
|
Filing Dt:
|
03/04/2016
|
|
Publication #:
|
|
Pub Dt:
|
09/15/2016
| | | | |
|
Title:
|
DUAL SUBSTRATE ELECTROSTATIC MEMS SWITCH WITH MULTIPLE HINGES AND METHOD OF MANUFACTURE
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
01/03/2017
|
Application #:
|
15098353
|
Filing Dt:
|
04/14/2016
|
|
Publication #:
|
|
Pub Dt:
|
10/20/2016
| | | | |
|
Title:
|
Anodic Bonding of Dielectric Substrates
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
11/15/2016
|
Application #:
|
15144735
|
Filing Dt:
|
05/02/2016
|
|
Title:
|
ETCHING TECHNIQUE FOR MICROFABRICATION SUBSTRATES
|
|
|
|
|
Patent #:
|
NONE
|
Issue Dt:
|
|
Application #:
|
15149217
|
Filing Dt:
|
05/09/2016
|
|
Publication #:
|
|
Pub Dt:
|
11/24/2016
| | | | |
|
Title:
|
THERMOCOMPRESSION BONDING WITH RAISED FEATURE
|
|
|
|
|
Patent #:
|
NONE
|
Issue Dt:
|
|
Application #:
|
15232871
|
Filing Dt:
|
08/10/2016
|
|
Publication #:
|
|
Pub Dt:
|
03/02/2017
| | | | |
|
Title:
|
DEVICE WITH SEPARATION LIMITING STANDOFF
|
|
|
|
|
Patent #:
|
NONE
|
Issue Dt:
|
|
Application #:
|
15237120
|
Filing Dt:
|
08/15/2016
|
|
Publication #:
|
|
Pub Dt:
|
03/02/2017
| | | | |
|
Title:
|
MEMS REED SWITCH DEVICE
|
|
|
|
|
Patent #:
|
NONE
|
Issue Dt:
|
|
Application #:
|
15272481
|
Filing Dt:
|
09/22/2016
|
|
Publication #:
|
|
Pub Dt:
|
08/17/2017
| | | | |
|
Title:
|
MICROFABRICATED OPTICAL APPARATUS
|
|
|
|
|
Patent #:
|
NONE
|
Issue Dt:
|
|
Application #:
|
15355461
|
Filing Dt:
|
11/18/2016
|
|
Publication #:
|
|
Pub Dt:
|
05/25/2017
| | | | |
|
Title:
|
MICROFABRICATED OPTICAL APPARATUS WITH INTEGRATED TURNING SURFACE
|
|
|
|
|
Patent #:
|
NONE
|
Issue Dt:
|
|
Application #:
|
15408956
|
Filing Dt:
|
01/18/2017
|
|
Publication #:
|
|
Pub Dt:
|
05/04/2017
| | | | |
|
Title:
|
MICROFABRICATED OPTICAL APPARATUS
|
|
|
|
|
Patent #:
|
NONE
|
Issue Dt:
|
|
Application #:
|
15415919
|
Filing Dt:
|
01/26/2017
|
|
Publication #:
|
|
Pub Dt:
|
08/03/2017
| | | | |
|
Title:
|
THROUGH SUBSTRATE VIAS USING SOLDER BUMPS
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
07/03/2018
|
Application #:
|
15634230
|
Filing Dt:
|
06/27/2017
|
|
Publication #:
|
|
Pub Dt:
|
11/23/2017
| | | | |
|
Title:
|
THERMOCOMPRESSION BONDING WITH RAISED FEATURE
|
|
