Patent Assignment Details
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| Reel/Frame: | 048226/0564 | |
| Pages: | 8 |
| | Recorded: | 02/01/2019 | | |
| Attorney Dkt #: | USCP10486C/NB4318-SYO |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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05/26/2020
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Application #:
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16157061
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Filing Dt:
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10/10/2018
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Publication #:
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Pub Dt:
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02/07/2019
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Title:
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Camera Module, Molded Circuit Board Assembly, Molded Photosensitive Assembly and Manufacturing Method Thereof
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Assignee
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| 66-68, SHUNYU ROAD, YUYAO, |
| NINGBO, ZHEJIANG, CHINA 315400 |
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Correspondence name and address
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DAVID AND RAYMOND PATENT FIRM
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108 N. YNEZ AVE., SUITE 128
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MONTEREY PARK, CA 91754
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