|
Total properties:
99
|
|
|
|
Patent #:
|
|
Issue Dt:
|
01/18/2000
|
Application #:
|
08591439
|
Filing Dt:
|
03/11/1996
|
|
Title:
|
CORROSION INHIBITING MULTILAYER COATING
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
07/14/1998
|
Application #:
|
08611679
|
Filing Dt:
|
03/06/1996
|
|
Title:
|
PROCESS FOR THE PRODUCTION OF CORROSION-PROTECTED METALLIC MATERIALS AND MATERIALS OBTAINABLE THEREWITH
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
03/24/1998
|
Application #:
|
08656410
|
Filing Dt:
|
05/30/1996
|
|
Title:
|
ALKOXYLATED DIMERCAPTANS AS COPPER ADDITIVES AND DE-POLARIZING ADDITIVES
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
12/08/1998
|
Application #:
|
08875480
|
Filing Dt:
|
07/29/1997
|
|
Title:
|
PROCESS FOR THE PRODUCTION OF METALLIZED MATERIALS
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
12/29/1998
|
Application #:
|
08888274
|
Filing Dt:
|
07/03/1997
|
|
Title:
|
CORROSION RESISTANT PAINT
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
05/28/2002
|
Application #:
|
08939656
|
Filing Dt:
|
09/29/1997
|
|
Publication #:
|
|
Pub Dt:
|
09/20/2001
| | | | |
|
Title:
|
PRINTED CIRCUIT BOARD MANUFACTURE
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
11/14/2000
|
Application #:
|
08963999
|
Filing Dt:
|
11/04/1997
|
|
Title:
|
ELECTROLESS NICKEL COBALT PHOSPHOROUS COMPOSITION AND PLATING PROCESS
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
06/15/1999
|
Application #:
|
08996925
|
Filing Dt:
|
12/23/1997
|
|
Title:
|
SURFACE DOPANTS AS BLEND COMPATIBLIZERS IN CONJUGATED POLYMERS
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
04/04/2000
|
Application #:
|
09046869
|
Filing Dt:
|
03/24/1998
|
|
Title:
|
DUCTILITY AGENTS FOR NICKEL-TUNGSTEN ALLOYS
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
02/25/2003
|
Application #:
|
09383718
|
Filing Dt:
|
08/26/1999
|
|
Title:
|
PROCESS FOR SELECTIVE DEPOSITION OF OSP COATING ON COPPER, EXCLUDING DEPOSITION ON GOLD
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
05/29/2001
|
Application #:
|
09394839
|
Filing Dt:
|
09/13/1999
|
|
Title:
|
WATER SOLUBLE BRIGHTENERS FOR ZINC AND ZINC ALLOY ELECTROLYTES
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
12/18/2001
|
Application #:
|
09403900
|
Filing Dt:
|
01/18/2000
|
|
Title:
|
BISMUTH COATING PROTECTION FOR COPPER
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
10/14/2003
|
Application #:
|
09463453
|
Filing Dt:
|
04/17/2000
|
|
Title:
|
CHEMICAL COMPOUNDS MADE OF INTRISICALLY CONDUCTIVE POLYMERS AND METALS
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
08/17/2004
|
Application #:
|
09716975
|
Filing Dt:
|
11/20/2000
|
|
Title:
|
ELECTROPLATING CHEMISTRY FOR THE CU FILLING OF SUBMICRON FEATURES OF VLSI/ULSI INTERCONNECT
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
10/21/2003
|
Application #:
|
09786300
|
Filing Dt:
|
07/13/2001
|
|
Title:
|
METHOD FOR COATING WORKPIECES
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
03/30/2004
|
Application #:
|
09831008
|
Filing Dt:
|
05/03/2001
|
|
Title:
|
PROCESS FOR METALLIZING A PLASTIC SURFACE
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
01/08/2008
|
Application #:
|
10091106
|
Filing Dt:
|
03/05/2002
|
|
Publication #:
|
|
Pub Dt:
|
09/11/2003
| | | | |
|
Title:
|
DEFECT REDUCTION IN ELECTRODEPOSITED COPPER FOR SEMICONDUCTOR APPLICATIONS
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
04/20/2004
|
Application #:
|
10092976
|
Filing Dt:
|
03/07/2002
|
|
Publication #:
|
|
Pub Dt:
|
09/19/2002
| | | | |
|
Title:
|
SYSTEM FOR THE ELECTRODIALYTIC REGENERATION OF AN ELECTROLESS BATH ELECTROLYTE
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
06/30/2015
|
Application #:
|
10099936
|
Filing Dt:
|
03/13/2002
|
|
Publication #:
|
|
Pub Dt:
|
03/01/2012
| | | | |
|
Title:
|
SOLDERABILITY ENHANCEMENT BY SILVER IMMERSION PRINTED CIRCUIT BOARD MANUFACTURE
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
03/01/2005
|
Application #:
|
10118417
|
Filing Dt:
|
04/08/2002
|
|
Publication #:
|
|
Pub Dt:
|
10/24/2002
| | | | |
|
Title:
|
PRINTED CIRCUIT BOARD MANUFACTURE
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
11/23/2004
|
Application #:
|
10129998
|
Filing Dt:
|
07/31/2002
|
|
Title:
|
PROCESS FOR THE NON-GALVANIC TIN PLATING OF COPPER OR COPPER ALLOYS
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
09/28/2004
|
Application #:
|
10148090
|
Filing Dt:
|
10/03/2002
|
|
Title:
|
PROCESS FOR THE EXTENDED USE OF ELECTROLYTES
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
01/04/2005
|
Application #:
|
10169959
|
Filing Dt:
|
10/03/2002
|
|
Publication #:
|
|
Pub Dt:
|
07/03/2003
| | | | |
|
Title:
|
METHOD FOR THE DEPOSITION OF A CHROMIUM ALLOY
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
05/24/2005
|
Application #:
|
10358596
|
Filing Dt:
|
02/05/2003
|
|
Publication #:
|
|
Pub Dt:
|
08/05/2004
| | | | |
|
Title:
|
COPPER BATH COMPOSITION FOR ELECTROLESS AND/OR ELECTROLYTIC FILLING OF VIAS AND TRENCHES FOR INTEGRATED CIRCUIT FABRICATION
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
06/19/2007
|
Application #:
|
10619198
|
Filing Dt:
|
07/14/2003
|
|
Publication #:
|
|
Pub Dt:
|
01/20/2005
| | | | |
|
Title:
|
ADHESION PROMOTION IN PRINTED CIRCUIT BOARDS
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
12/07/2010
|
Application #:
|
10678601
|
Filing Dt:
|
10/03/2003
|
|
Publication #:
|
|
Pub Dt:
|
07/29/2004
| | | | |
|
Title:
|
PROCESS AND ELECTROLYTES FOR DEPOSITION OF METAL LAYERS
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
09/11/2007
|
Application #:
|
10867346
|
Filing Dt:
|
06/14/2004
|
|
Publication #:
|
|
Pub Dt:
|
12/15/2005
| | | | |
|
Title:
|
CAPPING OF METAL INTERCONNECTS IN INTEGRATED CIRCUIT ELECTRONIC DEVICES
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
01/08/2013
|
Application #:
|
10902398
|
Filing Dt:
|
07/29/2004
|
|
Publication #:
|
|
Pub Dt:
|
02/02/2006
| | | | |
|
Title:
|
SILVER PLATING IN ELECTRONICS MANUFACTURE
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
08/23/2011
|
Application #:
|
10963369
|
Filing Dt:
|
10/12/2004
|
|
Publication #:
|
|
Pub Dt:
|
03/03/2005
| | | | |
|
Title:
|
COPPER ELECTRODEPOSITION IN MICROELECTRONICS
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
11/15/2011
|
Application #:
|
11039088
|
Filing Dt:
|
01/19/2005
|
|
Publication #:
|
|
Pub Dt:
|
09/08/2005
| | | | |
|
Title:
|
MAINTENANCE OF METALLIZATION BATHS
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
02/19/2008
|
Application #:
|
11085304
|
Filing Dt:
|
03/21/2005
|
|
Publication #:
|
|
Pub Dt:
|
04/20/2006
| | | | |
|
Title:
|
COBALT AND NICKEL ELECTROLESS PLATING IN MICROELECTRONIC DEVICES
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
08/25/2009
|
Application #:
|
11102038
|
Filing Dt:
|
04/08/2005
|
|
Publication #:
|
|
Pub Dt:
|
10/13/2005
| | | | |
|
Title:
|
METHOD FOR TREATING LASER-STRUCTURED PLASTIC SURFACES
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
08/12/2008
|
Application #:
|
11230912
|
Filing Dt:
|
09/20/2005
|
|
Publication #:
|
|
Pub Dt:
|
03/22/2007
| | | | |
|
Title:
|
DEFECTIVITY AND PROCESS CONTROL OF ELECTROLESS DEPOSITION IN MICROELECTRONICS APPLICATIONS
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
11/03/2009
|
Application #:
|
11243624
|
Filing Dt:
|
10/05/2005
|
|
Publication #:
|
|
Pub Dt:
|
03/22/2007
| | | | |
|
Title:
|
DEFECTIVITY AND PROCESS CONTROL OF ELECTROLESS DEPOSITION IN MICROELECTRONICS APPLICATIONS
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
11/03/2009
|
Application #:
|
11243631
|
Filing Dt:
|
10/05/2005
|
|
Publication #:
|
|
Pub Dt:
|
03/22/2007
| | | | |
|
Title:
|
DEFECTIVITY AND PROCESS CONTROL OF ELECTROLESS DEPOSITION IN MICROELECTRONICS APPLICATIONS
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
11/10/2009
|
Application #:
|
11243876
|
Filing Dt:
|
10/05/2005
|
|
Publication #:
|
|
Pub Dt:
|
03/22/2007
| | | | |
|
Title:
|
DEFECTIVITY AND PROCESS CONTROL OF ELECTROLESS DEPOSITION IN MICROELECTRONICS APPLICATIONS
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
12/04/2007
|
Application #:
|
11272999
|
Filing Dt:
|
11/14/2005
|
|
Publication #:
|
|
Pub Dt:
|
06/29/2006
| | | | |
|
Title:
|
COPPER ELECTRODEPOSITION IN MICROELECTRONICS
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
02/23/2010
|
Application #:
|
11279512
|
Filing Dt:
|
04/12/2006
|
|
Publication #:
|
|
Pub Dt:
|
10/12/2006
| | | | |
|
Title:
|
INSOLUBLE ANODE
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
12/07/2010
|
Application #:
|
11420339
|
Filing Dt:
|
05/25/2006
|
|
Publication #:
|
|
Pub Dt:
|
11/30/2006
| | | | |
|
Title:
|
METHOD FOR SUPPLYING A PLATING COMPOSITION WITH DEPOSITION METAL ION DURING A PLATING OPERATION
|
|
|
|
|
Patent #:
|
NONE
|
Issue Dt:
|
|
Application #:
|
11423474
|
Filing Dt:
|
06/12/2006
|
|
Publication #:
|
|
Pub Dt:
|
12/14/2006
| | | | |
|
Title:
|
METHOD FOR DIRECT METALLIZATION OF NON-CONDUCTING SUBSTRATES
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
05/11/2010
|
Application #:
|
11463355
|
Filing Dt:
|
08/09/2006
|
|
Publication #:
|
|
Pub Dt:
|
02/15/2007
| | | | |
|
Title:
|
TIN-SILVER SOLDER BUMPING IN ELECTRONICS MANUFACTURE
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
04/27/2010
|
Application #:
|
11549775
|
Filing Dt:
|
10/16/2006
|
|
Publication #:
|
|
Pub Dt:
|
04/17/2008
| | | | |
|
Title:
|
MANUFACTURE OF ELECTROLESS COBALT DEPOSITION COMPOSITIONS FOR MICROELECTRONICS APPLICATIONS
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
08/25/2009
|
Application #:
|
11554100
|
Filing Dt:
|
10/30/2006
|
|
Publication #:
|
|
Pub Dt:
|
05/03/2007
| | | | |
|
Title:
|
METHOD FOR ETCHING NON-CONDUCTIVE SUBSTRATE SURFACES
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
06/19/2012
|
Application #:
|
11563335
|
Filing Dt:
|
11/27/2006
|
|
Publication #:
|
|
Pub Dt:
|
05/31/2007
| | | | |
|
Title:
|
METHOD FOR REMOVING IMPURITIES FROM A METAL DEPOSITION PROCESS SOLUTION
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
09/14/2010
|
Application #:
|
11620857
|
Filing Dt:
|
01/08/2007
|
|
Publication #:
|
|
Pub Dt:
|
07/10/2008
| | | | |
|
Title:
|
ORGANIC SOLDERABILITY PRESERVATIVE COMPRISING HIGH BOILING TEMPERATURE ALCOHOL
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
02/08/2011
|
Application #:
|
11736647
|
Filing Dt:
|
04/18/2007
|
|
Publication #:
|
|
Pub Dt:
|
10/23/2008
| | | | |
|
Title:
|
METALLIC SURFACE ENHANCEMENT
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
10/19/2010
|
Application #:
|
11756048
|
Filing Dt:
|
05/31/2007
|
|
Publication #:
|
|
Pub Dt:
|
12/27/2007
| | | | |
|
Title:
|
DIRECT METALLIZATION OF ELECTRICALLY NON-CONDUCTIVE POLYIMIDE SUBSTRATE SURFACES
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
03/23/2010
|
Application #:
|
11759456
|
Filing Dt:
|
06/07/2007
|
|
Publication #:
|
|
Pub Dt:
|
10/04/2007
| | | | |
|
Title:
|
ADHESION PROMOTION IN PRINTED CIRCUIT BOARDS
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
03/27/2012
|
Application #:
|
11759624
|
Filing Dt:
|
06/07/2007
|
|
Publication #:
|
|
Pub Dt:
|
10/04/2007
| | | | |
|
Title:
|
ADHESION PROMOTION IN PRINTED CIRCUIT BOARDS
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
07/10/2018
|
Application #:
|
11766642
|
Filing Dt:
|
06/21/2007
|
|
Publication #:
|
|
Pub Dt:
|
12/25/2008
| | | | |
|
Title:
|
CORROSION PROTECTION OF BRONZES
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
05/07/2013
|
Application #:
|
11778011
|
Filing Dt:
|
07/13/2007
|
|
Publication #:
|
|
Pub Dt:
|
05/15/2008
| | | | |
|
Title:
|
Electrolyte Composition and Method for the Deposition of a Zinc-Nickel Alloy Layer on a Cast Iron Or Steel Substrate
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
10/19/2010
|
Application #:
|
11846385
|
Filing Dt:
|
08/28/2007
|
|
Publication #:
|
|
Pub Dt:
|
12/20/2007
| | | | |
|
Title:
|
COPPER ELECTRODEPOSITION IN MICROELECTRONICS
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
07/01/2008
|
Application #:
|
11852513
|
Filing Dt:
|
09/10/2007
|
|
Publication #:
|
|
Pub Dt:
|
12/27/2007
| | | | |
|
Title:
|
CAPPING OF METAL INTERCONNECTS IN INTEGRATED CIRCUIT ELECTRONIC DEVICES
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
07/05/2011
|
Application #:
|
11944287
|
Filing Dt:
|
11/21/2007
|
|
Publication #:
|
|
Pub Dt:
|
11/18/2010
| | | | |
|
Title:
|
ANTI-TARNISH COATINGS
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
12/29/2015
|
Application #:
|
11971061
|
Filing Dt:
|
01/08/2008
|
|
Publication #:
|
|
Pub Dt:
|
05/29/2008
| | | | |
|
Title:
|
DEFECT REDUCTION IN ELECTRODEPOSITED COPPER FOR SEMICONDUCTOR APPLICATIONS
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
06/05/2012
|
Application #:
|
12168680
|
Filing Dt:
|
07/07/2008
|
|
Publication #:
|
|
Pub Dt:
|
12/11/2008
| | | | |
|
Title:
|
ELECTROLYTE AND PROCESS FOR DEPOSITING A MATT METAL LAYER
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
03/02/2010
|
Application #:
|
12185641
|
Filing Dt:
|
08/04/2008
|
|
Publication #:
|
|
Pub Dt:
|
02/05/2009
| | | | |
|
Title:
|
COPPER METALLIZATION OF THROUGH SILICON VIA
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
08/16/2011
|
Application #:
|
12238139
|
Filing Dt:
|
09/25/2008
|
|
Publication #:
|
|
Pub Dt:
|
03/25/2010
| | | | |
|
Title:
|
SURFACE PREPARATION PROCESS FOR DAMASCENE COPPER DEPOSITION
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
07/24/2012
|
Application #:
|
12254207
|
Filing Dt:
|
10/20/2008
|
|
Publication #:
|
|
Pub Dt:
|
06/11/2009
| | | | |
|
Title:
|
COMPOSITE COATINGS FOR WHISKER REDUCTION
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
07/10/2012
|
Application #:
|
12268144
|
Filing Dt:
|
11/10/2008
|
|
Publication #:
|
|
Pub Dt:
|
05/14/2009
| | | | |
|
Title:
|
SELF ASSEMBLED MOLECULES ON IMMERSION SILVER COATINGS
|
|
|
|
|
Patent #:
|
NONE
|
Issue Dt:
|
|
Application #:
|
12278256
|
Filing Dt:
|
12/15/2008
|
|
Publication #:
|
|
Pub Dt:
|
12/31/2009
| | | | |
|
Title:
|
METHOD AND DEVICE FOR COATING SUBSTRATE SURFACES
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
03/05/2013
|
Application #:
|
12324335
|
Filing Dt:
|
11/26/2008
|
|
Publication #:
|
|
Pub Dt:
|
05/27/2010
| | | | |
|
Title:
|
METHOD AND COMPOSITION FOR ELECTRODEPOSITION OF COPPER IN MICROELECTRONICS WITH DIPYRIDYL-BASED LEVELERS
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
02/05/2013
|
Application #:
|
12440355
|
Filing Dt:
|
03/25/2009
|
|
Publication #:
|
|
Pub Dt:
|
01/21/2010
| | | | |
|
Title:
|
DEPOSITION OF CONDUCTIVE POLYMER AND METALLIZATION OF NON-CONDUCTIVE SUBSTRATES
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
12/15/2015
|
Application #:
|
12445049
|
Filing Dt:
|
10/13/2009
|
|
Publication #:
|
|
Pub Dt:
|
02/25/2010
| | | | |
|
Title:
|
CYANIDE-FREE ELECTROLYTE COMPOSITION, AND METHOD FOR THE DEPOSITION OF SILVER OR SILVER ALLOY LAYERS ON SUBSTRATES
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
06/28/2011
|
Application #:
|
12446176
|
Filing Dt:
|
04/17/2009
|
|
Publication #:
|
|
Pub Dt:
|
11/11/2010
| | | | |
|
Title:
|
COPPER DEPOSITION FOR FILLING FEATURES IN MANUFACTURE OF MICROELECTRONIC DEVICES
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
06/03/2014
|
Application #:
|
12596559
|
Filing Dt:
|
02/02/2010
|
|
Publication #:
|
|
Pub Dt:
|
06/17/2010
| | | | |
|
Title:
|
METALLIC SURFACE ENHANCEMENT
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
11/03/2015
|
Application #:
|
12607375
|
Filing Dt:
|
10/28/2009
|
|
Publication #:
|
|
Pub Dt:
|
04/28/2011
| | | | |
|
Title:
|
IMMERSION TIN SILVER PLATING IN ELECTRONICS MANUFACTURE
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
10/09/2012
|
Application #:
|
12617202
|
Filing Dt:
|
11/12/2009
|
|
Publication #:
|
|
Pub Dt:
|
05/13/2010
| | | | |
|
Title:
|
GALVANIC BATH AND PROCESS FOR DEPOSITING ZINC-BASED LAYERS
|
|
|
|
|
Patent #:
|
NONE
|
Issue Dt:
|
|
Application #:
|
12665908
|
Filing Dt:
|
08/09/2010
|
|
Publication #:
|
|
Pub Dt:
|
12/23/2010
| | | | |
|
Title:
|
CORROSION PROTECTION OF BRONZES
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
05/05/2015
|
Application #:
|
12672980
|
Filing Dt:
|
08/12/2010
|
|
Publication #:
|
|
Pub Dt:
|
06/16/2011
| | | | |
|
Title:
|
CHROMIUM-FREE PICKLE FOR PLASTIC SURFACES
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
12/22/2015
|
Application #:
|
12747681
|
Filing Dt:
|
07/19/2010
|
|
Publication #:
|
|
Pub Dt:
|
11/25/2010
| | | | |
|
Title:
|
ELECTROLYTIC DEPOSITION OF METAL-BASED COMPOSITE COATINGS COMPRISING NANO-PARTICLES
|
|
|
|
|
Patent #:
|
NONE
|
Issue Dt:
|
|
Application #:
|
13003398
|
Filing Dt:
|
06/15/2011
|
|
Publication #:
|
|
Pub Dt:
|
09/29/2011
| | | | |
|
Title:
|
ELECTROLYTE AND METHOD FOR DEPOSITION OF MATTE METAL LAYER
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
08/19/2014
|
Application #:
|
13054048
|
Filing Dt:
|
04/18/2011
|
|
Publication #:
|
|
Pub Dt:
|
07/28/2011
| | | | |
|
Title:
|
CYANIDE FREE ELECTROLYTE COMPOSITION FOR THE GALVANIC DEPOSITION OF A COPPER LAYER
|
|
|
|
|
Patent #:
|
NONE
|
Issue Dt:
|
|
Application #:
|
13125622
|
Filing Dt:
|
04/22/2011
|
|
Publication #:
|
|
Pub Dt:
|
08/18/2011
| | | | |
|
Title:
|
METHOD FOR DEPOSITION OF HARD CHROME LAYERS
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
12/29/2015
|
Application #:
|
13129300
|
Filing Dt:
|
07/25/2011
|
|
Publication #:
|
|
Pub Dt:
|
11/10/2011
| | | | |
|
Title:
|
METHOD FOR THE POST-TREATMENT OF METAL LAYERS
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
04/22/2014
|
Application #:
|
13176411
|
Filing Dt:
|
07/05/2011
|
|
Publication #:
|
|
Pub Dt:
|
07/12/2012
| | | | |
|
Title:
|
ANTI-TARNISH COATINGS
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
12/17/2013
|
Application #:
|
13214525
|
Filing Dt:
|
08/22/2011
|
|
Publication #:
|
|
Pub Dt:
|
02/23/2012
| | | | |
|
Title:
|
COPPER ELECTRODEPOSITION IN MICROELECTRONICS
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
02/24/2015
|
Application #:
|
13382131
|
Filing Dt:
|
03/07/2012
|
|
Publication #:
|
|
Pub Dt:
|
06/21/2012
| | | | |
|
Title:
|
METHOD FOR THE DEPOSITION OF A METAL LAYER COMPRISING A BETA-AMINO ACID
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
05/26/2015
|
Application #:
|
13431560
|
Filing Dt:
|
03/27/2012
|
|
Publication #:
|
|
Pub Dt:
|
03/28/2013
| | | | |
|
Title:
|
ADHESION PROMOTION IN PRINTED CIRCUIT BOARDS
|
|
|
|
|
Patent #:
|
NONE
|
Issue Dt:
|
|
Application #:
|
13487665
|
Filing Dt:
|
06/04/2012
|
|
Publication #:
|
|
Pub Dt:
|
11/29/2012
| | | | |
|
Title:
|
ELECTROLYTE AND PROCESS FOR DEPOSITING A MATT METAL LAYER
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
12/04/2012
|
Application #:
|
13545030
|
Filing Dt:
|
07/10/2012
|
|
Publication #:
|
|
Pub Dt:
|
11/01/2012
| | | | |
|
Title:
|
SELF ASSEMBLED MOLECULES ON IMMERSION SILVER COATINGS
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
12/09/2014
|
Application #:
|
13556522
|
Filing Dt:
|
07/24/2012
|
|
Publication #:
|
|
Pub Dt:
|
11/15/2012
| | | | |
|
Title:
|
COMPOSITE COATINGS FOR WHISKER REDUCTION
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
05/10/2016
|
Application #:
|
13558019
|
Filing Dt:
|
07/25/2012
|
|
Publication #:
|
|
Pub Dt:
|
01/30/2014
| | | | |
|
Title:
|
ADHESION PROMOTION IN PRINTED CIRCUIT BOARDS
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
04/11/2017
|
Application #:
|
13636087
|
Filing Dt:
|
02/04/2013
|
|
Publication #:
|
|
Pub Dt:
|
11/28/2013
| | | | |
|
Title:
|
METHOD FOR DIRECT METALLIZATION OF NON-CONDUCTIVE SUBSTRATES
|
|
|
|
|
Patent #:
|
NONE
|
Issue Dt:
|
|
Application #:
|
13638442
|
Filing Dt:
|
01/09/2013
|
|
Publication #:
|
|
Pub Dt:
|
05/23/2013
| | | | |
|
Title:
|
CORROSION-PROTECTIVE WAX COMPOSITION CONTAINING POLYANILINE IN A DOPED FORM AND A LIQUID PARAFFIN
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
03/05/2019
|
Application #:
|
13699910
|
Filing Dt:
|
12/12/2012
|
|
Publication #:
|
|
Pub Dt:
|
01/03/2019
| | | | |
|
Title:
|
COPPER FILLING OF THROUGH SILICON VIAS
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
03/24/2015
|
Application #:
|
13735779
|
Filing Dt:
|
01/07/2013
|
|
Publication #:
|
|
Pub Dt:
|
07/18/2013
| | | | |
|
Title:
|
SILVER PLATING IN ELECTRONICS MANUFACTURE
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
07/08/2014
|
Application #:
|
13785946
|
Filing Dt:
|
03/05/2013
|
|
Publication #:
|
|
Pub Dt:
|
09/19/2013
| | | | |
|
Title:
|
METHOD AND COMPOSITION FOR ELECTRODEPOSITION OF COPPER IN MICROELECTRONICS WITH DIPYRIDYL-BASED LEVELERS
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
07/10/2018
|
Application #:
|
13882330
|
Filing Dt:
|
02/05/2014
|
|
Publication #:
|
|
Pub Dt:
|
05/22/2014
| | | | |
|
Title:
|
COMPOSITION AND METHOD FOR THE DEPOSITION OF CONDUCTIVE POLYMERS ON DIELECTRIC SUBSTRATES
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
01/21/2020
|
Application #:
|
13981974
|
Filing Dt:
|
01/08/2014
|
|
Publication #:
|
|
Pub Dt:
|
05/01/2014
| | | | |
|
Title:
|
PROCESS FOR FILLING VIAS IN THE MICROELECTRONICS
|
|
|
|
|
Patent #:
|
NONE
|
Issue Dt:
|
|
Application #:
|
14001360
|
Filing Dt:
|
02/10/2014
|
|
Publication #:
|
|
Pub Dt:
|
06/05/2014
| | | | |
|
Title:
|
AQUEOUS SOLUTION AND METHOD FOR THE FORMATION OF A PASSIVATION LAYER
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
11/15/2016
|
Application #:
|
14108954
|
Filing Dt:
|
12/17/2013
|
|
Publication #:
|
|
Pub Dt:
|
04/17/2014
| | | | |
|
Title:
|
COPPER ELECTRODEPOSITION IN MICROELECTRONICS
|
|
|
|
|
Patent #:
|
NONE
|
Issue Dt:
|
|
Application #:
|
14234080
|
Filing Dt:
|
01/24/2014
|
|
Publication #:
|
|
Pub Dt:
|
06/12/2014
| | | | |
|
Title:
|
APPARATUS FOR ELECTROCHEMICAL DEPOSITION OF A METAL
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
04/04/2017
|
Application #:
|
14325601
|
Filing Dt:
|
07/08/2014
|
|
Publication #:
|
|
Pub Dt:
|
10/30/2014
| | | | |
|
Title:
|
METHOD AND COMPOSITION FOR ELECTRODEPOSITION OF COPPER IN MICROELECTRONICS WITH DIPYRIDYL-BASED LEVELERS
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
01/03/2017
|
Application #:
|
14350971
|
Filing Dt:
|
04/10/2014
|
|
Publication #:
|
|
Pub Dt:
|
09/11/2014
| | | | |
|
Title:
|
PROCESS FOR ELECTROLESS COPPER DEPOSITION ON LASER-DIRECT STRUCTURED SUBSTRATES
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
02/02/2016
|
Application #:
|
14630268
|
Filing Dt:
|
02/24/2015
|
|
Publication #:
|
|
Pub Dt:
|
06/18/2015
| | | | |
|
Title:
|
BETA-AMINO ACID COMPRISING PLATING FORMULATION
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
08/08/2017
|
Application #:
|
14666990
|
Filing Dt:
|
03/24/2015
|
|
Publication #:
|
|
Pub Dt:
|
09/10/2015
| | | | |
|
Title:
|
SILVER PLATING IN ELECTRONICS MANUFACTURE
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
09/05/2017
|
Application #:
|
14702020
|
Filing Dt:
|
05/01/2015
|
|
Publication #:
|
|
Pub Dt:
|
01/28/2016
| | | | |
|
Title:
|
CHROMIUM-FREE PICKLE FOR PLASTIC SURFACES
|
|
|
|
|
Patent #:
|
NONE
|
Issue Dt:
|
|
Application #:
|
14776879
|
Filing Dt:
|
09/15/2015
|
|
Publication #:
|
|
Pub Dt:
|
02/04/2016
| | | | |
|
Title:
|
ELECTRODEPOSITION OF SILVER WITH FLUOROPOLYMER NANOPARTICLES
|
|
