Patent Assignment Details
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| Reel/Frame: | 048303/0876 | |
| Pages: | 5 |
| | Recorded: | 02/12/2019 | | |
| Attorney Dkt #: | GBCQ001 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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10/25/2022
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Application #:
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16324893
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Filing Dt:
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02/11/2019
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Publication #:
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Pub Dt:
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04/23/2020
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Title:
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SnBiSb Series Low-temperature Lead-free Solder and its Preparation Method
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Assignee
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| 6# LEYUAN STEET, YANQI DEVELOPMENT AREA, HUAIROU DISTRICT BEIJING 101407, CN |
| BEIJING, CHINA 101407 |
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Correspondence name and address
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GOKALP BAYRAMOGLU
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1540 W. WARM SPRINGS ROAD SUITE 100
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HENDERSON, NV 89014
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