Patent Assignment Details
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| Reel/Frame: | 048372/0447 | |
| Pages: | 8 |
| | Recorded: | 02/19/2019 | | |
| Attorney Dkt #: | I2000.213.101 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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12/01/2020
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Application #:
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16279370
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Filing Dt:
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02/19/2019
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Publication #:
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Pub Dt:
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09/19/2019
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Title:
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CHIP PACKAGE WITH CROSS-LINKED THERMOPLASTIC DIELECTRIC
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Assignee
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| AM CAMPEON 1-15 |
| NEUBIBERG, GERMANY 85579 |
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Correspondence name and address
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DICKE, BILLIG & CZAJA
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FIFTH STREET TOWERS
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100 SOUTH FIFTH STREET, SUITE 2250
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MINNEAPOLIS, MN 55402
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