Patent Assignment Details
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Reel/Frame: | 048378/0938 | |
| Pages: | 6 |
| | Recorded: | 02/20/2019 | | |
Attorney Dkt #: | P/2850-618 |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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12/29/2020
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Application #:
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16280083
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Filing Dt:
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02/20/2019
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Publication #:
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Pub Dt:
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09/05/2019
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Title:
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SILICON CARBIDE EPITAXIAL WAFER HAVING A THICK SILICON CARBIDE LAYER WITH SMALL WRAPAGE AND MANUFACTURING METHOD THEREOF
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Assignee
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3-1, KASUMIGASEKI 1-CHOME, CHIYODA-KU |
TOKYO, JAPAN 100-8921 |
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Correspondence name and address
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OSTROLENK FABER LLP
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845 THIRD AVENUE
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NEW YORK, NY 10022
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