Patent Assignment Details
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| Reel/Frame: | 048467/0491 | |
| Pages: | 7 |
| | Recorded: | 02/28/2019 | | |
| Attorney Dkt #: | P56535 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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10/20/2020
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Application #:
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16304908
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Filing Dt:
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11/27/2018
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Publication #:
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Pub Dt:
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10/03/2019
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Title:
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RESIN COMPOSITION, LAMINATE INCLUDING THE RESIN COMPOSITION, SEMICONDUCTOR WAFER WITH RESIN COMPOSITION LAYER, SUBSTRATE FOR MOUNTING SEMICONDUCTOR WITH RESIN COMPOSITION LAYER, AND SEMICONDUCTOR DEVICE INCLUDING THE SEMICONDUCTOR WAFER WITH RESIN COMPOSITION LAYER
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Assignee
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| 5-2, MARUNOUCHI 2-CHOME, CHIYODA-KU |
| TOKYO, JAPAN 1008324 |
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Correspondence name and address
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GREENBLUM & BERNSTEIN P.L.C.
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1950 ROLAND CLARKE PLACE
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RESTON, VA 20191
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