Patent Assignment Details
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| Reel/Frame: | 048497/0576 | |
| Pages: | 3 |
| | Recorded: | 03/04/2019 | | |
| Attorney Dkt #: | TC19010046US-ICRD |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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10/06/2020
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Application #:
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16330087
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Filing Dt:
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03/03/2019
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Publication #:
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Pub Dt:
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07/11/2019
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Title:
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METHOD FOR HYBRID WAFER-TO-WAFER BONDING
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Assignee
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| NO.497, GAOSI ROAD, ZHANGJIANG HIGH-TECH PARK, PUDONG |
| SHANGHAI, CHINA 201210 |
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Correspondence name and address
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TIANCHEN LLC.
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3302 TOWER1, NO.388 ZHONGJIANG ROAD, PUT
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SHANGHAI, 200062 CHINA
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