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Reel/Frame:048514/0310   Pages: 3
Recorded: 03/06/2019
Attorney Dkt #:T5057-1328U
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 1
1
Patent #:
Issue Dt:
02/23/2021
Application #:
16252291
Filing Dt:
01/18/2019
Publication #:
Pub Dt:
08/15/2019
Title:
INTEGRATED CIRCUIT LAYOUT, STRUCTURE, SYSTEM, AND METHODS
Assignors
1
Exec Dt:
01/25/2019
2
Exec Dt:
02/22/2019
3
Exec Dt:
01/25/2019
4
Exec Dt:
01/25/2019
Assignee
1
NO. 8, LI-HSIN RD. VI, HSINCHU SCIENCE PARK
HSINCHU, TAIWAN 300
Correspondence name and address
HAUPTMAN HAM, LLP (TSMC)
2318 MILL ROAD
SUITE 1400
ALEXANDRIA, VA 22314

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