Patent Assignment Details
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Reel/Frame: | 048553/0607 | |
| Pages: | 4 |
| | Recorded: | 03/09/2019 | | |
Attorney Dkt #: | MIY-0583 |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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08/24/2021
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Application #:
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16331965
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Filing Dt:
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03/09/2019
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Publication #:
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Pub Dt:
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08/15/2019
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Title:
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CONDUCTIVE MATERIAL, CONNECTION STRUCTURE AND METHOD FOR PRODUCING CONNECTION STRUCTURE
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Assignee
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4-4, NISHITEMMA 2-CHOME, KITA-KU |
OSAKA-CITY, OSAKA, JAPAN 530-8565 |
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Correspondence name and address
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LEE CHENG
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1133 13TH STREET N.W. STE C2
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WASHINGTON, DC 20005
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