Patent Assignment Details
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Reel/Frame: | 048579/0306 | |
| Pages: | 8 |
| | Recorded: | 03/12/2019 | | |
Attorney Dkt #: | XMCP0008USA |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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11/17/2020
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Application #:
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16351407
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Filing Dt:
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03/12/2019
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Publication #:
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Pub Dt:
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10/31/2019
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Title:
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METHOD FOR IMPROVING BONDING OF DANGLING BONDS OF SILICON ATOMS
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Assignee
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NO.18, GAOXIN 4TH ROAD, DONGHU DEVELOPMENT ZONE |
WUHAN, HUBEI PROVINCE, CHINA |
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Correspondence name and address
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WINSTON HSU
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5F., NO.389, FUHE RD., YONGHE DIST.,
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NEW TAIPEI CITY, TAIWAN
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