Patent Assignment Details
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| Reel/Frame: | 048631/0445 | |
| Pages: | 5 |
| | Recorded: | 03/19/2019 | | |
| Attorney Dkt #: | OED_DEL |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
6
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Patent #:
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Issue Dt:
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03/24/2020
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Application #:
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14956906
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Filing Dt:
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12/02/2015
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Title:
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HEAT SINK PACKAGE
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Patent #:
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Issue Dt:
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07/11/2017
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Application #:
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14957940
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Filing Dt:
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12/03/2015
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Title:
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VCSEL WITH AT LEAST ONE THROUGH SUBSTRATE VIA
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Patent #:
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Issue Dt:
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10/08/2019
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Application #:
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14957981
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Filing Dt:
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12/03/2015
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Title:
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VCSEL WITH EMISSION ON SUBSTRATE SIDE
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Patent #:
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Issue Dt:
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03/08/2022
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Application #:
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14958389
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Filing Dt:
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12/03/2015
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Title:
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METHOD TO FORM A SELF-ALIGNED EVAPORATED METAL CONTACT IN A DEEP HOLE AND VCSEL WITH SUCH CONTACT
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Patent #:
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Issue Dt:
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10/27/2020
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Application #:
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15438322
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Filing Dt:
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02/21/2017
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Publication #:
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Pub Dt:
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06/08/2017
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Title:
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STRESS RELIEF IN SEMICONDUCTOR WAFERS
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Patent #:
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Issue Dt:
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07/09/2019
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Application #:
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15703253
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Filing Dt:
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09/13/2017
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Publication #:
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Pub Dt:
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03/22/2018
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Title:
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METALLIC, TUNABLE THIN FILM STRESS COMPENSATION FOR EPITAXIAL WAFERS
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Assignee
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| 1105 NORTH MARKET STREET |
| WILMINGTON, DELAWARE 19801 |
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Correspondence name and address
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WENDY W. KOBA
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PO BOX 556
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SPRINGTOWN, PA 18081
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