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Reel/Frame:048636/0720   Pages: 8
Recorded: 03/19/2019
Attorney Dkt #:172250USP
Conveyance: CORRECTIVE ASSIGNMENT TO CORRECT THE THE LAST INVENTOR NAME PREVIOUSLY RECORDED AT REEL: 48317 FRAME: 091. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT.
Total properties: 1
1
Patent #:
NONE
Issue Dt:
Application #:
16086333
Filing Dt:
09/19/2018
Publication #:
Pub Dt:
03/21/2019
Title:
MULTILAYER INTERCONNECTION SUBSTRATE FOR HIGH FREQUENCY AND MANUFACTURING METHOD THEREOF
Assignors
1
Exec Dt:
07/20/2018
2
Exec Dt:
07/20/2018
3
Exec Dt:
07/17/2018
4
Exec Dt:
07/17/2018
5
Exec Dt:
07/20/2018
Assignee
1
3-9-1 SHIBAURA, MINATO-KU
TOKYO, JAPAN 108-0023
Correspondence name and address
PATTERSON & SHERIDAN, LLP
24 GREENWAY PLAZA
SUITE 1600
HOUSTON, TX 77046

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